BA60BC0FP データシートの表示（PDF） - ROHM Semiconductor
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BA60BC0FP Datasheet PDF : 19 Pages
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BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5
Datasheet
Application Information
●I/O equivalence circuit
Vcc
* For the BA00BC0WT, connect R1 and
Vcc
R2 externally between the C and GND
pins and between the OUT and C pins.
CTL
27kΩ 2kΩ
31kΩ
Fig.16
R2
R1
Fig.17
OUT
Equation: VO = Vc × (R1 + R2) / R1
(Vc = 1.25 V (Typ.))
The recommended R1 value is
approximately 30 kΩ to 150 kΩ.
●Power Dissipation
• TO220FP-3/TO220FP-5/TO220FP-5V5）
25
(1) When using an infinite heat sink.
θj-c = 6.25 (°C/W)
(1)20.0
20
(2) During IC without heat sink operation.
θj-a = 62.5 (°C/W)
15
10
• TO252-3/TO252-5
2.0
IC mounted on a ROHM standard board
Board size: 70 × 70 × 1.6 mm
Copper foil area: 7 × 7 mm
1.6
TO252-5 θja=96.2 (°C/W)
1.30
TO252-3 θja＝104.2 (°C/W)
1.2
TO252-5
0.8
5
(2)2.0
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE：Ta [°C]
Fig.18
TO252-3
0.4
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE：Ta [°C]
Fig.19
The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum
junction temperature Tjmax, deterioration or damage may occur. Implement proper thermal designs to ensure that power
dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the
reliability of the IC for long-term operation.
The following method is used to calculate the power consumption Pc (W).
Pc = (Vcc – Vo) × Io + Vcc × Icca
Power dissipation Pd ≧ Pc
The load current Io is calculated:
Pd − Vcc × Icca
Io ≦
Vcc − Vo
Vcc : Input voltage
Vo : Output current
IO : Load current
Icca : Circuit current
Calculation Example:
Vcc = 6.0 V and Vo = 5.0 V at Ta = 85°C
Io≦ 0.676 − 6.0 × Icca
6.0 − 5.0
θja = 96.2°C/W → −10.4mW/°C
25°C = 1300mW → 85°C = 676mW
Io ≦ 550mA (Icca ≈ 20mA)
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TSZ22111･15･001
8/16
TSZ02201-0R6R0A600120-1-2
26.Jun.2012 Rev.001
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