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L88MS33T データシートの表示(PDF) - SANYO -> Panasonic

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L88MS33T Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Pd max – Ta
With infinite heat sink
L88MS33T
Mounted on copper-clad
area of 2,000 mm2
Mounted on copper-clad
area 740 mm2
Mounted on copper-clad
area 180 mm2
Mounted on copper-clad
area 36 mm2
No heat sink
Ambient temperature, Ta – °C
1) The allowable power dissipation is 1.0 W (Ta = 25°C) with no fin attached, but when mounted on a hybrid IC board or
printed circuit board, high allowable power dissipation is achieved, despite the compact package. The graph below depicts the
relationship between the copper-clad area and allowable power dissipation when mounted on a glass epoxy board
(50 × 5 0 × 0.8 mm3) with a copper thickness of 18 µm.
Pd max – S
Board
Copper-clad area S
(mm2)
Copper-clad area, S – mm2
2) Pd is the value for when the solder on the surface of the IC heat sink has melted completely and the surface mount is
horizontal.
3) Please be advised that the flow solder application system (full-heat method) cannot be recommended.
Lead Formings
MA forming
LR forming
FA forming
No.5516-5/7

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