(3)AV1432E
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AVXX32E -A SERIES
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Note: The IC substrate should be connect to VSS
Pad No. Pad Name X(um)
1
PAD_OSC 108.75
2
PAD_OKY 108.75
3
PAD_OPA 291.65
4
PAD_OPB 573.45
5 PAD_TG3OPC 764.75
6
PAD_TEST 994.65
Y(um)
214.1
94.05
94.05
94.05
94.05
94.05
Pad No.
7
8
9
10
11
12
Pad Name
X(um)
Y(um)
PAD_TG1
1279.2
94.05
PAD_TG0
1279.2
214.1
VDD
1302.8
867
PAD_PWM2 1101.9
867
PAD_PWM1
681.1
867
VSS
480.2
867
Chip size : 1387.9 x 968 (Pm)2
Preliminary
9-9
Ver. 0.1