Philips Semiconductors
31/2-digit LCD car clock
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
Product specification
PCF1172C
y
F4
G4
B3
A3
F3
G3
2.66 mm
P1, P2
P3, P4
B2
A2
F2
0
G2
0
PCF1172CU
C4
D4
E4
C3
D3
E3
C2
D2
E2
AM
PM
x
2.36 mm
MSA988
n.c. = not connected.
Chip area: 6.28 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 381 ±25 µm.
Fig.4 Bonding pad locations, PCF1172CU; 40 terminals.
1997 Apr 16
7