Data Sheet AS1105
Absolute Maximum Ratings
Voltage (with respect to GND)
VDD
DIN, CLK, LOAD
All Other Pins
Current
DIG0–DIG3 Sink Current
SEGA–G, DP Source Current
Continuous Power Dissipation (TA = +85°C)
Wide SO (derate 11.8mW/°C above +70°C)
Operating Temperature Ranges (TMIN to TMAX)
AS1105xL
AS1105xE
Storage Temperature Range
Package body temperature 2
-0.3V to 6V
-0.3V to 6V
-0.3V to (VDD +0.3V)
500mA
100mA
941mW
0°C to +70°C
-40°C to +85°C
-65°C to +150°C
+240°C
Electrical Characteristics
(VDD = 5V, RSET = 9.53kΩ±1%, TA = TMIN to TMAX, unless otherwise noted.)
Parameter
Symbol Conditions
Min
Operating Supply Voltage
VDD
4.0
Shutdown Supply Current
IDDSD
All digital inputs at VDD or GND, TA =
+25°C
RSET = open circuit
Operating Supply Current
IDD All segments and decimal point on, ISEG = -
40mA
Display Scan Rate
fOSC
500
Digit Drive Sink Current
IDIGIT VOUT = 0.65V
320
Segment Drive Source Current ISEG TA = +25°C, VOUT = (VDD -1V)
-30
Segment Drive Current
Matching
∆ISEG
Digit Drive Source Current
IDIGIT Digit off, VDIGIT = (VDD -0.3V)
-2
Segment Drive Sink Current
ISEG Segment off, VSEG = 0.3V
5
Logic Inputs
Input Current DIN, CLK, LOAD IIH, IIL VIN = 0V or VDD
-1
Logic High Input Voltage
VIH
3.5
Typ Max
5.0
5.5
20
50
500
330
800 1300
-40
-45
3.0
1
Units
V
µA
µA
mA
Hz
mA
mA
%
mA
mA
µA
V
2 The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020B “Moisture/Reflow Sensitivity
Classification for non-hermetic Solid State Surface Mount Devices”.
Revision 1.32, Oct. 2004
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