APL5315(2007) データシートの表示（PDF） - Anpec Electronics

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APL5315
(Rev.:2007)

Selectable Adjustable/Fixed Low dropout 300mA Linear Regulator

Anpec Electronics 

APL5315

Physical Specifications

Terminal Material

Lead Solderability

Solder-Plated Copper (Solder Material: 90/10 or 63/37 SnPb), 100%Sn

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

TP

tp

Ramp-up

TL

tL

Tsmax

Critical Zone

TL to TP

Tsmin

ts

Preheat

Ramp-down

25

t 25°C to Peak

Time

Classification Reflow Profiles

Profile Feature

Average ramp-up rate

(TL to TP)

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

Time maintained above:

- Temperature (TL)

- Time (tL)

Peak/Classification Temperature (Tp)

Time within 5°C of actual

Peak Temperature (tp)

Ramp-down Rate

Time 25°C to Peak Temperature

Sn-Pb Eutectic Assembly

3°C/second max.

100°C

150°C

60-120 seconds

183°C

60-150 seconds

See table 1

10-30 seconds

6°C/second max.

6 minutes max.

Pb-Free Assembly

3°C/second max.

150°C

200°C

60-180 seconds

217°C

60-150 seconds

See table 2

20-40 seconds

6°C/second max.

8 minutes max.

Notes: All temperatures refer to topside of the package. Measured on the body surface.

Copyright © ANPEC Electronics Corp.

14

Rev. A.2 - Mar., 2007

www.anpec.com.tw

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