1N5818RLG データシートの表示（PDF） - ON Semiconductor
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1N5818RLG Datasheet PDF : 7 Pages
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1N5817, 1N5818, 1N5819
90
80
BOTH LEADS TO HEATSINK,
EQUAL LENGTH
70
60
MAXIMUM
50
TYPICAL
40
30
20
10
1 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0
L, LEAD LENGTH (INCHES)
Figure 4. Steady−State Thermal Resistance
5.0
Sine Wave
3.0 I(FM) = π (Resistive Load)
2.0 I(AV)
{5
Capacitive
1.0 Loads
10
0.7
20
0.5
0.3
0.2
dc
SQUARE WAVE
TJ ≈ 125°C
0.1
0.07
0.05
0.2
0.4 0.6 0.8 1.0
2.0
4.0
IF(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 5. Forward Power Dissipation
1N5817−19
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.1 0.2
0.5 1.0 2.0
ZqJL(t) = ZqJL • r(t)
Ppk
Ppk
DUTY CYCLE, D = tp/t1
tp
PEAK POWER, Ppk, is peak of
an
TIME equivalent square power pulse.
t1
DTJL = Ppk • RqJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)] where
DTJL = the increase in junction temperature above the lead temperature
r(t) = normalized value of transient thermal resistance at time, t, from Figure 6,
i.e.:
r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
5.0 10
20
50 100 200
t, TIME (ms)
500 1.0k 2.0k
5.0k 10k
Figure 6. Thermal Response
NOTE 4. — MOUNTING DATA
Data shown for thermal resistance, junction−to−ambient
(RqJA) for the mountings shown is to be used as typical guide-
line values for preliminary engineering, or in case the tie
point temperature cannot be measured.
TYPICAL VALUES FOR RqJA IN STILL AIR
Mounting
Lead Length, L (in)
Method
1/8
1/4
1/2
3/4
1
52
65
72
85
2
67
80
87
100
3
50
RqJA
°C/W
°C/W
°C/W
Mounting Method 1
P.C. Board with
1−1/2″ x 1−1/2″
copper surface.
L
L
Mounting Method 2
L
L
VECTOR PIN MOUNTING
http://onsemi.com
4
Mounting Method 3
P.C. Board with
1−1/2″ x 1−1/2″
copper surface.
L = 3/8″
BOARD GROUND
PLANE
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