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RMPA29000
27–30 GHz 1 Watt Power
Amplifier MMIC
Figure 4
Recommended
Assembly and
Bonding Diagram
Vg
(Negative)
PRODUCT INFORMATION
Vd
(Positive)
10000pF
2 mil Gap
100pF
5mil Thick
Alumina
50-Ohm
RF
Input
10000pF
Die-Attach
80Au/20Sn
100pF
5 mil Thick
Alumina
50-Ohm
RF
Output
100pF
100pF
10000pF
10000pFz
Vg
(Negative)
Vd
(Positive)
L< 0.015”
(4 Places)
www.raytheon.com/micro
Note:
Use 0.003” x 0.0005” Gold Ribbon for bonding. RF input and output bonds should be less than 0.015” long with stress relief.Vd should be
biased from 1 supply on both sides as shown. Vg can be biased from either or both sides from 1 supply.
Characteristic performance data and specifications are subject to change without notice.
Revised January 18, 2001
Page 4
Raytheon RF Components
362 Lowell Street
Andover, MA 01810