ADIS16265(RevF) データシートの表示（PDF） - Analog Devices
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ADIS16265 Datasheet PDF : 20 Pages
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ADIS16260/ADIS16265
APPLICATIONS INFORMATION
ASSEMBLY
When developing a process flow for installing ADIS16260/
ADIS16265 devices on printed circuit boards (PCBs), see
the JEDEC J-STD-020C standard document for the reflow
temperature profile and processing information. The ADIS16260/
ADIS16265 can use the Sn-Pb eutectic process and the Pb-free
eutectic process from this standard, with one exception, the
peak temperature exposure is 240°C. For a more complete list
of assembly process suggestions, see the ADIS162xx LGA
Assembly Guidelines page on Engineer Zone. Figure 18
provides an example pattern for the location of the
ADIS16260/ADIS16265 on a printed circuit board.
3.800
8×
5.0865
8×
0.773
16×
10.173 7.600
2×
4×
0.500
20×
1.127
20×
11mm × 11mm STACKED LGA PACKAGE
Figure 18. Recommended Pad Layout (Units in Millimeters)
BIAS OPTIMIZATION
Use the following steps to fine-tune the bias to an accuracy that
approaches the in-run bias stability, 0.007°/sec (1 σ).
1. Apply 5 V and wait 10 sec.
2. Set SENS_AVG[10:8] = 001 (DIN = 0xB901).
3. Set GYRO_OFF = 0x0000
(DIN = 0x9400, DIN = 0x9500).
4. Collect GYRO_OUT data for 150 sec at a sample rate of
256 SPS.
5. Average data record.
6. Round to the nearest integer.
Data Sheet
7. Multiply by −1.
8. Write to GYRO_OFF.
9. Update flash, set GLOB_CMD[3] = 1 (DIN = 0xBE08), and
wait for >50 ms and resume operation.
The Allan Variance curve in Figure 6 provides a trade-off
relationship between accuracy and averaging time. For example,
an average time of 1 second produce an accuracy of ~0.035 °/sec
(1 σ).
INTERFACE PRINTED CIRCUIT BOARD
The ADIS16265/PCBZ includes one ADIS16265BCCZ IC on a
1.2 inch × 1.3 inch PCB. The interface PCB simplifies the IC
connection of these devices to an existing processor system. The
four mounting holes accommodate either M2 (2 mm) or 2-56
machine screws. These boards are made of IS410 material and
are 0.063 inches thick. The second-level assembly uses a
SAC305-compatible solder composition, which has a presolder
reflow thickness of approximately 0.005 inches.
The pad pattern on these PCBs matches that shown in Figure 20.
J1 and J2 are dual-row, 2 mm (pitch) connectors that work with
a number of ribbon cable systems, including 3M Part Number
152212-0100-GB (ribbon crimp connector) and 3M Part Number
3625/12 (ribbon cable). The schematic and connector pin
assignments for the ADIS16265/PCBZ are shown in Figure 19.
1
7 RST
2
1 SCLK
3
4 CS
4
2 DOUT
AUX ADC 13
1
2
AUX DAC 12
3
VREF 20
4
5
6
3 DIN ADIS16265
5
6
7
18 GND
7
8
19 GND
8
9
9
10
16 VCC
10
11
17 VCC
DIO2 6
11
C1
12
DIO1 5
12
RATE FILT
14
15
C2
Figure 19. Electrical Schematic
Rev. F | Page 18 of 20
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