ADIS16251 データシートの表示（PDF） - Analog Devices

部品番号

コンポーネント説明

一致するリスト

ADIS16251

Programmable Low Power Gyroscope

Analog Devices 

ADIS16251

SECOND-LEVEL ASSEMBLY

The ADIS16251 can be attached to the second-level assembly

board using SN63 (or equivalent) or a Pb-free solder. Figure 20

and Table 40 provide acceptable solder reflow profiles for each

solder type. Please note that these profiles may not be the opti-

mum profile for the user’s application. In no case should 260°C

be exceeded. It is recommended that the user develop a reflow

profile based upon the specific application.

In general, the lowest peak temperature and shortest dwell time

above the melt temperature of the solder result in less shock and

less stress to the product. In addition, evaluating the cooling

rate and peak temperature can result in a more reliable assembly.

Table 40. Acceptable Solder Reflow Profiles1

Profile Feature

Average Ramp Rate (TL to TP)

Preheat

Minimum Temperature (TSMIN)

Maximum Temperature (TSMAX)

Time (Between TSMIN to TSMAX) (ts)

TSMAX to TL

Ramp-Up Rate

Time Maintained Above Liquidous Temperature (TL)

Liquidous Temperature (TL)

Time (tL)

Peak Temperature (TP)

Time Within 5°C of Actual Tp

Ramp-Down Rate

Time 25°C to Tp

1 Per IPC/JEDEC J-STD-020C.

TP

TL

TSMAX

TSMIN

tP

RAMP-UP

CRITICAL ZONE

TL TO TP

tL

tS

PREHEAT

RAMP-DOWN

t25°C TO PEAK

TIME

Figure 20. Acceptable Solder Reflow Profiles

Sn63/Pb37

3°C/sec max

100°C

150°C

60 sec to 120 sec

3°C/sec

183°C

60 sec to 150 sec

240°C + 0°C/–5°C

10 sec to 30 sec

6°C/sec max

6 min max

Conditions

Pb-Free

3°C/sec max

150°C

200°C

60 sec to 180 sec

3°C/sec

217°C

60 sec to 150 sec

260°C + 0°C/–5°C

20 sec to 40 sec

6°C/sec max

8 min max

Rev. A | Page 20 of 20

Share Link: