ADG801(Rev0) データシートの表示（PDF） - Analog Devices
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ADG801 Datasheet PDF : 8 Pages
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ADG801/ADG802
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Inputs2 . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V
or 30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 400 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 800 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range Automotive . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (TJmax) . . . . . . . . . . . . . . . . . . . 150°C
Package Power Dissipation . . . . . . . . . . . . . . (TJmax – TA)/JA
µSOIC Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package (4-Layer Board)
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability. Only one absolute maximum
rating may be applied at any one time.
2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table
ADG801 In ADG802 In Switch Condition
0
1
OFF
1
0
ON
PIN CONFIGURATIONS
6-Lead Plastic Surface-Mount (SOT-23)
(RT-6)
D 1 ADG801/ 6 VDD
S 2 ADG802 5 NC
GND
3
TOP VIEW
(Not to Scale)
4
IN
NC = NO CONNECT
8-Lead Small Outline SOIC
(RM-8)
D1
8S
ADG801/
NC 2 ADG802 7 GND
NC 3 TOP VIEW 6 IN
VDD 4 (Not to Scale) 5 NC
NC = NO CONNECT
ORDERING GUIDE
Model
Temperature Range
Brand1
Package Descriptions
ADG801BRT
ADG801BRM
ADG802BRT
ADG802BRM
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
SLB
SLB
SMB
SMB
SOT-23 (Plastic Surface-Mount)
µSOIC (Small Outline)
SOT-23 (Plastic Surface-Mount)
µSOIC (Small Outline)
1Branding on SOT-23 and µSOIC packages is limited to three characters due to space constraints.
2Contact factory for availability.
Package Options
RT-62
RM-8
RT-62
RM-8
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG801/ADG802 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. 0
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