ADG733 データシートの表示（PDF） - Analog Devices
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ADG733 Datasheet PDF : 11 Pages
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ADG733/ADG734
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . .100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (A, B Versions) . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
16-Lead TSSOP, θJA Thermal Impedance . . . . . . . 150.4°C/W
20-Lead TSSOP, θJA Thermal Impedance . . . . . . . . 143°C/W
16-Lead QSOP, θJA Thermal Impedance . . . . . . . 149.97°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG733/ADG734 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
Model
ADG733BRU
ADG733BRQ
ADG734BRU
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
ORDERING GUIDE
Package Description
Thin Shrink Small Outline Package (TSSOP)
Quarter Size Outline Package (QSOP)
Thin Shrink Small Outline Package (TSSOP)
PIN CONFIGURATIONS
TSSOP/QSOP
TSSOP
S2B 1
S2A 2
16 VDD
15 D2
S3B 3 ADG733 14 D1
D3 4 TOP VIEW 13 S1B
(Not to Scale)
S3A 5
12 S1A
EN 6
11 A0
VSS 7
GND 8
10 A1
9 A2
IN1 1
20 IN4
S1A 2
19 S4A
D1 3
18 D4
S1B 4 ADG734 17 S4B
VSS 5 TOP VIEW 16 VDD
(Not to Scale)
GND 6
15 NC
S2B 7
14 S3B
D2 8
13 D3
S2A 9
12 S3A
IN2 10
11 IN3
NC = NO CONNECT
Package Option
RU-16
RQ-16
RU-20
REV. 0
–5–
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