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AD8390ACP データシートの表示(PDF) - Analog Devices

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AD8390ACP Datasheet PDF : 16 Pages
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AD8390
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
VOCM
Package Power Dissipation
Maximum Junction Temperature (TJ MAX)
Operating Temperature Range (TA)
Storage Temperature Range
Lead Temperature (Soldering 10 s)
Rating
±13.2 V (26.4 V)
VEE < VOCM < VCC
(TJ MAX – TA)/θJA
150°C
–40°C to +85°C
–65°C to +150°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TYPICAL THERMAL PROPERTIES
Table 4.
Package
16-lead LFCSP (CP-16)
JEDEC 2S2P – 0 airflow
Paddle soldered to board
Nine thermal vias in pad
16-lead QSOP/EP (RC-16)
JEDEC 1S2P – 0 airflow
Paddle soldered to board
Nine thermal vias in pad
Typical Thermal Resistance (θJA)
30.4°C/W
44.3°C/W
49.9
RG = 1k
RF = 10k
VIN
RG = 1k
AD8390
RL,DM = 100VOUT,DM
49.9
RF = 10k
Figure 3. Basic Test Circuit
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 5 of 16

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