5962-89805012A データシートの表示（PDF） - Analog Devices

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5962-89805012A

Integrated Circuit True RMS-to-DC Converter

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Supply Voltage

Dual Supply

Single Supply

Internal Power Dissipation

Maximum Input Voltage

Buffer Maximum Input Voltage

Maximum Input Voltage

Storage Temperature Range

Operating Temperature Range

AD536AJ/AD536AK

AD536AS

Lead Temperature (Soldering, 60 sec)

ESD Rating

Thermal Resistance θJA1

10-Pin Header (H-10 Package)

20-Terminal LCC (E-20 Package)

14-Lead SBDIP (D-14 Package)

14-Lead CERDIP (Q-14 Package)

Rating

±18 V

+36 V

500 mW

±25 V peak

±VS

±25 V peak

−55°C to +150°C

0°C to +70°C

−55°C to +125°C

300°C

1000 V

150°C/W

95°C/W

95°C/W

95°C/W

1 θJA is specified for the worst-case conditions, that is, a device soldered in a

circuit board for surface-mount packages.

AD536A

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

0.1315 (3.340)

+VS

COM

RL

14

10

9

IOUT

8

0.0807

(2.050)

VIN

1A1

BUF IN

VIN

7

1B1

–VS

CAV dB

BUF OUT

3

45

6

PAD NUMBERS CORRESPOND TO PIN NUMBERS FOR THE

TO-100 14-LEAD CERAMIC DIP PACKAGE.

1BOTH PADS SHOWN MUST BE CONNECTED TO VIN.

THE AD536A IS AVAILABLE IN LASER-TRIMMED CHIP FORM.

SUBSTRATE CONNECTED TO –VS.

Figure 2. Die Dimensions and Pad Layout

Dimensions shown in inches and (millimeters)

Rev. E | Page 5 of 16

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