A3904 データシートの表示（PDF） - Allegro MicroSystems
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A3904 Datasheet PDF : 9 Pages
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A3904
Low Voltage Voice Coil Motor Driver
CW Package, 8-Bondpad Bare Die
0.330
B 8X0.065
A
Die Alignment on Wafer
Die Pitch 1.100 × 0.750
1.055
8X0.065 B
0.705
All dimensions nominal; not for tooling use
Dimensions in millimeters
Exact configuration at supplier discretion within limits shown
A Die orientation mark area
B Bond pad opening in passivation
Top layer polymide
SLEEPZ
SCL
SDA
GND
IOUT
VDD
Bondpad*
X Coordinate
(μm)
Y Coordinate
(μm)
GND
444.5
269.45
IOUT_1
408.7
9.7
IOUT_2
319.95
233.55
SDA
–421.65
–242.6
SCL_1
136.3
–243.7
SCL_2
–421.65
9.0
SLEEPZ
–421.65
242.6
VDD
396.15
–238.5
*Redundant bondpads are electrically equivalent and provide alternative
locations for bonding.
Allegro MicroSystems, Inc.
8
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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