74LCX540MSAX(2006) データシートの表示（PDF） - Fairchild Semiconductor

部品番号

コンポーネント説明

一致するリスト

74LCX540MSAX
(Rev.:2006)

Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs

Fairchild Semiconductor 

March 2006

74LCX540

Low Voltage Octal Buffer/Line Driver

with 5V Tolerant Inputs and Outputs

Features

■ 5V tolerant input and outputs

■ 2.3V–3.6V VCC specifications provided

■ 6.5ns tPD max (VCC = 3.3V), 10µA ICC max

■ Power down high impedance inputs and outputs

■ Supports live insertion/withdrawal(1)

■ Implements patented noise/ EMI reduction circuitry

■ Latch-up performance exceeds JEDEC 78 conditions

■ ESD performance

– Human body model > 2000V

– Machine model > 200V

■ Leadless Pb-Free DQFN package

General Description

The LCX540 is an octal buffer/line driver designed to be

employed as a memory and address driver, clock driver

and bus oriented transmitter/receiver.

This device is similar in function to the LCX240 while

providing flow-through architecture (inputs on opposite

side from outputs). This pinout arrangement makes this

device especially useful as an output port for micropro-

cessors, allowing ease of layout and greater PC board

density.

The LCX540 is designed for low voltage (2.5V or 3.3V)

VCC applications with capability of interfacing to a 5V

signal environment. The LCX540 is fabricated with an

advanced CMOS technology to achieve high speed

operation while maintaining CMOS low power dissipa-

tion.

Ordering Information

Package

Order Number Number

Package Description

74LCX540WM

M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

74LCX540SJ

74LCX540BQX(2)

M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),

JEDEC MO-241, 2.5 x 4.5mm

74LCX540MSA

MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide

74LCX540MTC

74LCX540MTC_NL(3)

MTC20

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,

4.4mm Wide

Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC

MO-153, 4.4mm Wide

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Pb-Free package per JEDEC J-STD-020B.

Notes:

1. To ensure the high impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum

value of the resistor is determined by the current-sourcing capability of the driver.

2. DQFN package available in Tape and Reel only.

3. “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.

©2006 Fairchild Semiconductor Corporation

1

74LCX540 Rev. 1.0.0

www.fairchildsemi.com

Share Link: