W83194BR-138 データシートの表示（PDF） - Winbond
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W83194BR-138 Datasheet PDF : 14 Pages
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W83194BR-138
6.0 SPECIFICATIONS
PRELIMINARY
6.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Subjection to maximum conditions for extended periods may affect reliability.
Unused inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol
Vdd , VIN
TSTG
TB
TA
Parameter
Voltage on any pin with respect to GND
Storage Temperature
Ambient Temperature
Operating Temperature
Rating
- 0.5 V to + 7.0 V
- 65°C to + 150°C
- 55°C to + 125°C
0°C to + 70°C
6.2 AC CHARACTERISTICS
VddR=Vdd3=VddP=VddS=3.3V ± 5 %, VddC = VddA= 2.375V~2.9V , TA = 0°C to +70°C
Parameter
Symbol Min Typ Max Units
Test Conditions
Output Duty Cycle
45 50
55
% Measured at 1.5V
CPU/SDRAM to PCI Offset
tOFF
1
4
ns 15 pF Load Measured at 1.5V
Skew (CPU-CPU), (PCI- tSKEW
PCI), (SDRAM-SDRAM)
250
ps 15 pF Load Measured at 1.5V
CPU/SDRAM
tCCJ
Cycle to Cycle Jitter
±250
ps
CPU/SDRAM
tJA
Absolute Jitter
500
ps
Jitter Spectrum 20 dB
BWJ
500 KHz
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
tTLH
0.4
tTHL
1.6
ns 15 pF Load on CPU and PCI
outputs
Overshoot/Undershoot
Beyond Power Rails
Vover
0.7
1.5
V 22 Ω at source of 8 inch PCB
run to 15 pF load
Ring Back Exclusion
VRBE
0.7
2.1
V Ring Back must not enter this
range.
- 11 -
Publication Release Date: May 2000
Revision 0.37
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