TGA8334 データシートの表示（PDF） - TriQuint Semiconductor
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TGA8334 Datasheet PDF : 7 Pages
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RECOMMENDED
TEST
CONFIGURATION
RECOMMENDED
ASSEMBLY
DIAGRAM
Product Data Sheet
TGA8334-SCC
RF connections: Bond using two 1.0-mil diameter, 20 to 25-mil-length gold bond wires at both RF Input and
RF Output.
DC blocks required at RF Output port.
Close placement of external components is essential to stability.
Refer to TriQuint’s Recommended Assembly Instructions for GaAs Products.
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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