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10XS3435(2009) データシートの表示(PDF) - Freescale Semiconductor

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10XS3435
(Rev.:2009)
Freescale
Freescale Semiconductor Freescale
10XS3435 Datasheet PDF : 51 Pages
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RESISTANCE
Thermal Resistance(7)
Junction to Case
Junction to Ambient
Peak Package Reflow Temperature During Reflow(8), (9)
RθJC
RθJA
TPPRT
<1.0
30
Note 9
°C/ W
°C
Notes
7. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board).
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
10XS3435
7

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