CX805-30 BASEBAND PROCESSOR PRODUCT SUMMARY
10 x 10 FPBGA - 180 Balls/ 0.50 mm Pitch
10.00 ± 0.10
1.4 MAX
A1 Ball Pad Corner
Pin 1 Indicator
0.25 ± 0.05
17 15 13 11 9 7 5 3 1
18 16 14 12 10 8 6 4 2
10.00±0.10
A
B
C
D
Ø0.3 ± 0.05 TYP
E
F
0.25
G
H
J
K
L
0.5
M
N
P
Mold
R
T
U
V
Seating Plane
NOTES:
1. All dimensions are in millimeter
2. For die orientation see appropriate bonding diagram
3. FPBGA Lands are solder mask defined
4. Minimum solder pitch is 0.50 mm
5. Dimensioning and tolerancing in accordance with ASME Y14.5 M - 1994
0.25
0.5
Figure 3. 180-pin FPBGA and Lead-free 180-pin Lead-free FPBGA Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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June 21, 2005 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • 103171D