TSC101(2007) データシートの表示（PDF） - STMicroelectronics
部品番号
コンポーネント説明
一致するリスト
TSC101 Datasheet PDF : 17 Pages
| |||
TSC101
6
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 24. SOT23-5 package
Ref.
Millimeters
Min.
Typ.
A
0.90
A1
0.00
A2
0.90
b
0.35
C
0.09
D
2.80
E
2.60
E1
1.50
e
0.95
e1
1.9
L
0.35
Dimensions
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
Min.
35.4
0.00
35.4
13.7
3.5
110.2
102.3
59.0
0.55
13.7
Mils
Typ.
37.4
74.8
Max.
57.1
5.9
51.2
19.7
7.8
118.1
118.1
68.8
21.6
15/17
Share Link: 