MMG3002NT1 データシートの表示（PDF） - Freescale Semiconductor

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MMG3002NT1

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Freescale Semiconductor 

1.7

3.48

5.33

1.27

0.58

0.86

0.64

3.86

Recommended Solder Stencil

7.62

0.305 diameter

2.49

1.27

2.54

NOTES:

1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE

USED IN PCB LAYOUT DESIGN.

2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS

POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.

3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN

AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO

THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL

AND RF PERFORMANCE.

4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM

PITCH.

Figure 23. Recommended Mounting Configuration

RF Device Data

Freescale Semiconductor, Inc.

MMG3002NT1

11

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