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DF21-20P-0.6PTB データシートの表示(PDF) - HIROSE ELECTRIC

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DF21-20P-0.6PTB Datasheet PDF : 6 Pages
1 2 3 4 5 6
BUsage Recommendations
1. Recommended
Temperature Profile
Temperature
250ç
IR re-flow
Preheating : 150ç for 30 to 90 sec.
Soldering : 235ç±5ç for 10 sec max.
220çmin. for 10 to 20 sec.
200ç
150ç
100ç
50ç
Preheating
0s
50 s
90 s
240ç max.
220ç
Soldering
150 s Time
Note 1: Up to 2 cycles of reflow soldering are possible under the same conditions, provided that
there is a return to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface temperature at the point of contacts
with the connector terminals (for surface mounted plug assembly).
1. Recommended
2. Receptacle Recommended
Manual Soldering Conditions
Soldering temperature: 290ç ±10ç, Soldering time: within 2 sec.
Soldering temperature: 290ç ±10°C, soldering time: within 2 sec.
3. Recommended Screen Thickness
4. Board Warping
5. Cleaning Conditions
6. Plug Recommended
Soldering Conditions
0.15mm
Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
Refer to "Nylon Connector Use Handbook."
260ç ±5ç within 5 sec, 200ç min. within 25 sec.
7. Handling and use
precautions
sDO NOT mate/un-mate non-terminated plugs with non-mounted receptacles.
This may lead to damage or deformation of the contacts.
sDO NOT touch the exposed contacts of the receptacle with bare fingers. This may leave non-conductive film,
cause corrosion or electrostatic discharge, affecting performance of the connectors or sensitive electronic
components.
sDO NOT apply flux to the contact terminals when hand soldering the receptacle to the board. Wicking of the
flux into the electrical contact areas may lead to connection failures.
6

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