PAD LAYOUT
(Unit : µm)
CF5008A1
UNUSED2 VDD
UNUSED1
XT2
INH (1400,1300)
1 2 34
5
87
6
(0,0) VSS XT
Q
Chip size: 1.40 × 1.30 mm
Chip thickness: 220 ± 30 µm
Chip base: V D D level
PAD DIMENSIONS
Number
Name
I/O
1
UNUSED1
–
2
UNUSED2
–
3
XT2
O
4
VDD
–
5
INH
I
6
Q
O
7
XT
I
8
VSS
–
Description
Not used.
Not used.
Oscillator output pin
Supply voltage
Output-control input pin. Q signal output enabled when HIGH
or open. High-impedance output when LOW .
Output pin
Oscillator input pin
Ground
Pad dimensions [µm]
X
Y
153
1112
425
1112
660
1112
865
1112
1202
1112
1245
152
346
188
155
188
NIPPON PRECISION CIRCUITS—2