STPS30150C(2010) データシートの表示（PDF） - STMicroelectronics
部品番号
コンポーネント説明
一致するリスト
STPS30150C Datasheet PDF : 11 Pages
| |||
STPS30150C
Characteristics
Figure 11. Forward voltage drop versus
Figure 12. Thermal resistance junction to
forward current (maximum values,
per diode)
ambient versus copper surface
under tab for D2PAK
IFM(A)
100.0
Tj=125°C
(maximum values)
10.0
1.0
Tj=125°C
(typical values)
Tj=25°C
(maximum values)
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
Epoxy printed circuit board FR4,
copper thickness: 35µm
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
10
0
0
S(Cu)(cm²)
5
10
15
20
25
30
35
40
Doc ID 7757 Rev 8
5/11
Share Link: 