µPC1093
µPC1093T: Power mini mold (SOT-89)
Process
Infrared ray reflow
VPS
Wave soldering
Conditions
Peak temperature: 235 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
µPC1093TA: 5-pin plastic mini mold (SC-74A)
Process
Infrared ray reflow
VPS
Wave soldering
Conditions
Peak temperature: 235 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 3 times.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 3 times.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
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