NAA141S-B データシートの表示（PDF） - Unspecified

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NAA141S-B

Numeric Display/Case Size 9.6 x 13.0 mm

Unspecified 

141S/143S Series

Numeric Display/Case Size 9.6 x 13.0 mm

TTW (Through The Wave) soldering Conditions

Pre-heating

100 ℃

60 s

(MAX.) Resin surface temperature

(MAX.)

Solder Bath Temp.

Dipping Time

265 ℃

5s

(MAX.)

(MAX.)

Position

At least 2.0 mm away from the root of lead

1) The dip soldering process shall be 2 times maximum.

2) The product shall be cooled to normal temperature before the second dipping process.

Manual Soldering Conditions

Iron tip temp.

Soldering time and frequency

Position

400 ℃ (MAX.) (30 W Max.)

3 s (MAX.)

2 times (MAX.)

At least 2.0 mm away from the root of lead

2007.8.31

Page 10

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