2N6547 データシートの表示（PDF） - ON Semiconductor
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2N6547 Datasheet PDF : 8 Pages
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2N6547
MAXIMUM RATED SAFE OPERATING AREAS
50
10 ms
20
10
5.0 ms 1.0 ms
5.0
100 µs
2.0
dc
1.0
0.5
TC = 25°C
0.2
0.1
BONDING WIRE LIMITED
0.05
THERMAL LIMIT (SINGLE PULSE)
0.02
SECOND BREAKDOWN LIMIT
0.01 CURVES APPLY BELOW RATED VCEO
2N6546
2N6547
0.005
5.0 7.0 10
20 30 50 70 100
200
300 400
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 7. Forward Bias Safe Operating Area
20 TURN OFF LOAD LINE
BOUNDARY FOR 2N6547.
FOR 2N6546, VCEO AND
16 VCEX ARE 100 VOLTS LESS.
12
VCEX(sus)
8.0
8.0 V
4.0 VBE(off) v 5 V
TC v 100°C
VCEO(sus)
VCEX(sus)
0
0
100
200
300
400
500
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 8. Reverse Bias Safe Operating Area
There are two limitations on the power handling ability of
100
a transistor: average junction temperature and second
80
SECOND BREAKDOWN
DERATING
breakdown. Safe operating area curves indicate IC – VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
60
THERMAL DERATING
40
20
dissipation than the curves indicate.
The data of Figure 7 is based on TC = 25_C; TJ(pk) is
variable depending on power level. Second breakdown
pulse limits are valid for duty cycles to 10% but must be
derated when TC ≥ 25_C. Second breakdown limitations do
not derate the same as thermal limitations. Allowable
current at the voltages shown on Figure 7 may be found at
any case temperature by using the appropriate curve on
0
Figure 9.
0
40
80
120
160
TC, CASE TEMPERATURE (°C)
200
TJ(pk) may be calculated from the data in Figure 10. At
high case temperatures, thermal limitations will reduce the
Figure 9. Power Derating
power that can be handled to values less than the limitations
imposed by second breakdown.
1.0
0.7 D = 0.5
0.5
0.3
0.2
0.2
0.1
0.1
0.07
0.05
0.05
0.02
0.03
0.02
0.01 SINGLE PULSE
0.01
0.01 0.02
0.05 0.1 0.2
ZθJC (t) = r(t) RθJC
RθJC = 1.0°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) ZθJC(t)
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
0.5 1.0 2.0
5.0 10
20
t, TIME (ms)
50 100 200
500 1.0 k
Figure 10. Thermal Response
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