HCS374D データシートの表示（PDF） - Intersil

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HCS374D

Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered

Intersil 

HCS374MS

Die Characteristics

DIE DIMENSIONS:

108 x 106 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCS374MS

D0

Q0

OE

VCC

Q7

(3)

(2)

(1)

(20)

(19)

D1 (4)

Q1 (5)

Q2 (6)

(18) D7

(17) D6

(16) Q6

(15) Q5

D2 (7)

(14) D5

(8)

(9)

D3

Q3

(10)

(11)

GND

CP

(12)

(13)

Q4

D4

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCS374 is TA14304B.

Spec Number 518770

10

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