STW14NC50 データシートの表示（PDF） - STMicroelectronics
部品番号
コンポーネント説明
一致するリスト
STW14NC50 Datasheet PDF : 8 Pages
| |||
STW14NC50
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max
0.66
Rthj-amb Thermal Resistance Junction-ambient Max
30
Tl
Maximum Lead Temperature For Soldering Purpose
300
AVALANCHE CHARACTERISTICS
Symbol
Parameter
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
Max Value
14
800
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max.
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
500
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
50
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ±30V
±100
°C/W
°C/W
°C
Unit
A
mJ
Unit
V
µA
µA
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS, ID = 250 µA
VGS = 10V, ID = 7A
Min.
2
Typ.
3
0.31
Max.
4
0.38
Unit
V
Ω
DYNAMIC
Symbol
Parameter
gfs
Forward Transconductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS > ID(on) x RDS(on)max,
ID =7A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
13
2000
300
43
Max.
Unit
S
pF
pF
pF
2/8
Share Link: 