µ PC1933
6. RECOMMENDED SOLDERING CONDITIONS
Recommended solder conditions for this product are described below.
For details on recommended soldering conditions, refer to Information Document “Semiconductor Device Mounting
Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface Mount Type
µ PC1933GR: 8-pin plastic SOP (5.72 mm (225))
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Package peak temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.),
Number of times: 3 MAX.
Package peak temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),
Number of times: 3 MAX.
Soldering bath temperature: 260 °C MAX., Time: 10 seconds MAX.,
Number of times: 1,
Preheating temperature: 120 °C MAX. (package surface temperature)
Caution Do not use two or more soldering methods in combination.
Symbol of Recommended
Conditions
IR35-00-3
VP15-00-3
WS60-00-1
18
Data Sheet G13690EJ3V0DS00