CS8361
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA:
RQJA + RQJC ) RQCS ) RQSA
(3)
where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heatsink thermal resistance, and
RqSA = the heatsink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it too is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
ORDERING INFORMATION*
Device
CS8361YDPS7G
CS8361YDPSR7G
Package
D2PAK−7
(Pb−Free)
D2PAK−7
(Pb−Free)
Shipping†
50 Units/Rail
750 / Tape & Reel
CS8361YDWF16G
SO−16L
(Pb−Free)
46 Units/Rail
CS8361YDWFR16G
SO−16L
(Pb−Free)
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-
cifications Brochure, BRD8011/D.
*Contact your local sales representative for other package options including PSOP−20, TO−220−7, DIP−16, and SO−20L.
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