AS5050 データシートの表示（PDF） - austriamicrosystems AG
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AS5050 Datasheet PDF : 22 Pages
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AS5050
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Electrical Parameters
Parameter
Min
Max Units
Comments
VDD
DC supply voltage
VDDp
Peripheral supply voltage
Vin
Input pin voltage
Iscr
Input current (latchup immunity)
Electrostatic Discharge
ESD
Electrostatic discharge
Theta_JA
Package thermal resistance
Continuous Power Dissipation
-0.3
5.0
Value of these process dependent parameters
V are according to Process Parameter document,
current version
-0.3 VDD+0.3 V
-0.3
5.0
V
-100
100
mA
Norm: Jedec 78
±1
-
kV
-
33.5 °C/W
Norm: MIL 883 E method 3015
Velocity=0, Multi Layer PCB;
Jedec Standard Testboard
Pt
Total power dissipation
Temperature Ranges and Storage Conditions
36
mW
Tstrg
Storage temperature
-55
125
°C
Tbody
Package body temperature
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
260
°C Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing
5
85
%
MSL
Moisture Sensitive Level
3
Represents a maximum floor life time of 168h
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