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Package Outline Unit : mm
CXG1068N
20PIN SSOP(PLASTIC)
∗5.0 ± 0.05
A
20
11
A
1.25MAX
S
1
10
0.5
b
0.1 M S A
0.1 S
0.25
0.1 ± 0.1
B
b = 0.22 ± 0.05
(0.2)
b = 0.2 ± 0.03
DETAIL B : SOLDER
DETAIL B : PALLADIUM
0° to 10°
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-20P-L03
SSOP020-P-0044
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
COPPER ALLOY
0.1g
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